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HIGH CURRENT POWER INDUCTORS
1. PART NO. EXPRESSION :
SDL1108N SERIES
SDL1108N-R47MF
(a) (b) (c) (d) (e) (f)
(a) Series code (b) Dimension code (c) Material code
(d) Inductance code : R47 = 0.47uH (e) Tolerance code : M = 20% (f) F : RoHS Compliant
2. CONFIGURATION & DIMENSIONS :
B
A
R80
D OO E
C
F
Unit : mm Part No. SDL1108N-R30MF SDL1108N-R47MF SDL1108N-R56MF SDL1108N-R60MF SDL1108N-R80LF SDL1108N-1R0MF SDL1108N-R47MF SDL1108N-R56MF SDL1108N-R60MF SDL1108N-R80LF SDL1108N-1R0MF A 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 12.5 Max. 11.7 Max. 11.7 Max. B 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. 11.7 Max. C 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. D 3.50.5 3.50.5 3.50.5 3.50.5 3.50.5 3.50.5 3.50.5 3.50.5 3.50.3 3.50.5 3.50.3 E 6.30.5 6.30.5 6.30.5 6.30.5 6.30.5 6.30.5 6.70.5 6.40.5 6.60.5 6.60.5 5.70.5 F 5.70.5 5.70.5 5.70.5 5.70.5 6.40.5 5.70.5 6.40.5 6.30.5 6.60.5 6.60.5 7.90.5 OO 1.50.1 1.50.1 1.50.1 1.50.1 1.30.1 1.10.1 1.10.1 1.20.1 1.00.1 1.00.1 0.80.1
3. SCHEMATIC :
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
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HIGH CURRENT POWER INDUCTORS
4. MATERIALS :
SDL1108N SERIES
b
(a) Core : Iron Core (b) Wire : Enamelled Copper Wire
a
5. GENERAL SPECIFICATION : a) Operating temp. : -40C to +125C b) Storage temp. : -40C to +125C c) Ambient temp. : 20C d) Irms (A) : Will cause the coil temperature rise approximately T=40C without core loss e) Isat (A) : Will cause L0 to drop approximately 20% typical f) Part temperature (ambient + temp. rise) : Should not exceed 125C under worst case operating conditions
6. ELECTRICAL CHARACTERISTICS : Inductance L 0 ( H ) 0.3020% 0.4720% 0.5620% 0.6020% 0.8015% 1.020% 1.220% 1.520% 2.020% 2.220% 3.320% Test Frequency ( Hz ) 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K 1V / 100K DCR (m ) 8% 0.8 0.8 1.3 0.8 1.3 2.2 2.2 1.8 3.3 4.0 6.0 Irms (A) Typ. 38 38 32 38 31 29 20 25 21 15 12 Isat (A) Typ. 50 50 40 50 45 40 30 31 30 25 15
Part No. SDL1108N-R30MF SDL1108N-R47MF SDL1108N-R56MF SDL1108N-R60MF SDL1108N-R80LF SDL1108N-1R0MF SDL1108N-1R2MF SDL1108N-1R5MF SDL1108N-2R0MF SDL1108N-2R2MF SDL1108N-3R3MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT POWER INDUCTORS
7. CHARACTERISTICS CURVES :
SDL1108N-R30MF DLPI1108N-R30M-K01
SDL1108N SERIES
SDL1108N-R30MF
DC CURRENT (A)
SDL1108N-R47MF
0.45 0.36 0.27 0.18 0.09 0
SDL1108N-R47MF
DC CU RRENT (A)
SDL1108N-R56MF
SDL1108N-R56MF
SDL1108N-R60MF DLPI1108N-R60M-K01
SDL1108N-R60MF
2.00 1.50 1.00 0.50 0.00 DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT POWER INDUCTORS
7. CHARACTERISTICS CURVES :
SDL1108N-R80LF DLPI1108N-R80L
1.0 0.8 0.6 0.4 0.2 0.0
SDL1108N SERIES
SDL1108N-R80LF DLPI1108N-R80L
DC CURRENT(A)
D C CU RRENT(A)
SDL1108N-1R0MF
SDL1108N-1R0MF DLPI11 08N-1R0M-K01 2.0 1.5 1.0 0.5 0.0 DC CURRENT(A)
S P I11 08 N -1R 2 M DLDL1108N-1R2M F
2.0 1.6 1.2 0.8 0.4 0.0 DC CU R RE NT (A )
S DL1108N-1R2M F DLPI1108N-1R2M
SDL1108N-1R5MF DLPI1108N-1R5M-K01
4 3 2 1 0 DC CURRENT (A)
SDL1108N-1R5MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT POWER INDUCTORS
7. CHARACTERISTICS CURVES :
SDL1108N-2R0MF DLPI1108N-2R0
3 100
SDL1108N SERIES
SDL1108N-2R2MF
2.4
80
INDUCTANCE (uH)
1.8
60
1.2
40
0.6
20
0
0
0
6
12
18
24
30
DC CURRENT(A)
SDL1108N-2R2MF
5.0 4.0 3.0 2.0 1.0 0.0
TEMP. RISE(oC)
D L PI1 10 8N -3R 3 M -K0 1 SDL1108N-3R3MF
D C CU RR E N T (A )
SDL1108N-3R3MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH CURRENT POWER INDUCTORS
8. RELIABILITY AND TEST CONDITION :
SDL1108N SERIES
ITEM
Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms)
PERFORMANCE
Refer to standard electrical characteristics list
TEST CONDITION
HP4284A, CH3252A, CH1320, CH1320S LCR meter. CH1320, Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20%.
Saturation Current (Isat) Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder.
Preheat : 150C, 60sec. Solder : lead free Solder Temperature : 2455C Flux for lead free : rosin Dip Time : 41sec.
Preheating 245C Dipping Natural cooling
150C
60 seconds
41 seconds
Solder Heat Resistance
1. Components should have no evidence of electrical & mechanical damage. 2. Inductance : Within 20% of initial value.
Preheat : 150C, 60sec. Solder : lead free Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec.
Preheating 260C Dipping Natural cooling
150C
60 seconds
100.5 seconds
Reliability Test High Temperature Life Test Temperature : 1255C Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within 20% of initial value. No disconnection or short circuit. Temperature : -555C Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (C) -403 Room Temperature 1253 Room Temperature Times (min.) 303 Within 3 303 Within 3
Low Temperature Life Test
Thermal Shock
Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within 20% of initial value. No disconnection or short circuit. Temperature : 405C Humidity : 90% to 95% Applied Current : Rated Current Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT POWER INDUCTORS
9. SOLDERING AND MOUNTING :
H
SDL1108N SERIES
G
G
H 6.30.5
I 1.8 Ref.
J 9.00.5
6.40.5
OI
9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs.
TEMPERATURE C
TEMPERATURE C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
J
Preheating
250~260 230 180 150 60~120s
Soldering
10s max.
Natural cooling
Preheating
350 300 150
Soldering
Natural cooling
30~60s
Over 1min. Within 3secs.
Gradual Cooling
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH CURRENT POWER INDUCTORS
10. PACKING AND QUANTITY : Size Styrofoam Inner box Carton SDL1108N 108 756 1512
SDL1108N SERIES
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.07.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8

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